Packages


Ceramic Pin Grid Array Packages (CPGA)
CPGAs are typically a square ceramic multilayer package with an array of "pins" brazed onto (either) the front side of the package (cavity down) or on the backside of the package (cavity up). Minimum pin count is 28 while the maximum pin count is limited to the manufacturer's capabilities.

We stock lead counts of 28 up to 391 (leads).

Chelsea Technology CPGAs feature:

  • Excellent electrical performance in a wide range of package sizes
  • Small through hole mounting package with rugged construction
  • High I/O signal carrying capacity
  • Hermetically encapsulated packages offering enhanced thermal dissipation

Ceramic Quad Flat Pack (CQFP)
CQFPs are hermetic multilayer packages with the leads brazed on the top or bottom of the package.

Chelsea Technology CQFPs Feature:

  • Lead counts from 28 to 340
  • Lead pitch from 15.7 mils to 50 mils
  • Flexibility of surface-mount board level assembly or socketing
  • EIAJ or JEDEC configurations
  • Lead form: Flat, Gull Wing, J-Bend
  • Lead Plating: Gold, Solder Dip, or Tin


Ceramic Small Outline Packages (CSOP)
Ceramic Small Outline Packages offer a readily available surface mount alternative to plastic surface packages.

Chelsea Technology Ceramic Small Outline Packages feature:

  • A hermetic package with the same footprint as plastic SOPs
  • Package ideal for prototyping
  • Easily sealed with an epoxy perform to either a ceramic or plastic lid

CERDIPs
CERDIPs offer a cost effective, high performance, alternative to the standard three-layer ceramic package. The package consists of an alumina (AI203) base and lid, hermetically sealed to the lead frame with solder glass available in pin configurations from 14 to 40.

Chelsea Technology CERDIPs feature:

  • Low cost, high performance
  • Open tooled, hermetic packages
  • Military approved packages


Cerpacs
Cerpacs are either square or rectangular in shape and offer a low cost alternative to a flat-pack surface mount package. The package consists of an alumina (AI203) base and lid, hermetically sealed to the lead frame with solder glass available in pin configurations from 14 to 20.

Chelsea Technology Cerpacs feature:

  • Lead pitch based on JEDEC standards
  • Available with either flat leaded, J-bend, or gullwing lead configurations


Cerquads - EIJA and JEDEC

Cerquads are a pressed powder, single layer package consisting of either a square or rectangular shaped base, top coated with solder glass. Lead frames are embedded into the glass to create both internal die connection and external board connection.

Chelsea Technology Cerquad's feature:

  • Surface mount pressed ceramic Package
  • Footprint compatible with PQFP
  • Lead Form: flat, gull wing, J-Bend
  • Lead plating: gold, solder dip or tin
  • Bond finger plating: gold or aluminum
  • EIAJ or JEDEC configurations
  • Glass or epoxy seal



Flat Packs

Flat Packs are generally found in lead counts of 8 - 28. Chelsea Technology's extensive inventory includes flat packs ranging from 6 leads to 64 leads. These lightweight packages have small body outlines, and usually have leads on two sides of the package, which are parallel to the seating plane.

Chelsea Technology Cerpacs feature:

  • Small leaded surface mount package
  • Military hermetic package


J Lead Chip Carriers Ceramic

J lead clip carriers are often used in high heat dissipation applications. The external lead frame is formed into a J- shape to allow for socketing or direct board soldering.

Chelsea Technology J Lead chip carrier's feature:

  • Multilayer ceramic package
  • Excellent electrical performance and thermal management
  • Footprint compatible with LCC and PLCC
  • Surface mount or socket applications
  • Gold plated leads
  • Solder, glass or epoxy seal



Transistor Outline (TO) Headers

TO Headers offer single piece construction for added strength and resistance to stress. The absence of sidewalls help to facilitate circuit installation, as well as inspection and test accessibility.

Chelsea Technology TO Headers feature:

  • High reliability
  • Wide variety of sizes and lead counts


Hybrid Packages - Ceramic and Metal

Hybrid Packages are special carriers of hybrid microcircuits and other components interconnected as one unit, or as a component of an electronic subsystem.

Chelsea Technology offers a wide variety of package configurations including:

  • Ceramic
  • Metal
  • DIP style
  • Flat pack



Leadless Chip Carriers (LCC)

LCCs are low profile packages ideal for surface mount applications. Conventional, JEDEC and other standard types are also available. LCCs can be soldered directly to the PC board or used in a socket.

Chelsea Technology LCC's offer:

  • Available in lead counts from 3 to 84
  • Low cost solution for surface mount leadless packages
  • Light weight, adaptable to a variety of applications
  • No metallic external leads


Microwave Transistor (Micro-T) Packages

Micro-T packages are leaded multilayer ceramic packages specially designed to handle high frequency microwave diodes.

Chelsea Technology Micro-T's offer:

  • A hermetic packaging solution
  • An approved military package for microwave diodes
  • Either solder or epoxy seal
  • Miniaturized package sizes, .070" or .100" square

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Plastic Equivalent Packages

Plastic equivalent packages can be used for prototype die testing for market evaluation or for production since it precisely matches equivalent plastic package outline standards. Packages can be sealed using a plastic or ceramic cap with epoxy preform, as well as epoxy (glob top).

Chelsea Technology Plastic Equivalent Packages feature:

  • Glass-ceramic composite material construction
  • A hermetic package with the same footprint as plastic packages
  • Package ideal for prototyping
  • Easily sealed with an epoxy perform to either a ceramic or plastic lid
  • Gold plated Kovar lead frame and die attach pad


Plastic Pin Grid Array Packages (PPGA)

PPGAs are a microchip design that have the silicon core of the microchip facing down toward the computer motherboard. The core is covered by a heat slug, which helps to dissipate the heat to the heatsink.

Chelsea Technology's PPGAs offer:

  • Cost effective alternative to slot-based chips

Plastic Pn Grid Array Packages

Power TO Packages

Power Transistor Outline (TO) Packages

TO headers are intended for high reliability miniature microcircuit applications. The single piece construction provides great strength and resistance to stress. The absence of sidewalls help to facilitate circuit installation, as well as inspection and test accessibility.

Chelsea Technology TO Packages offer:

  • Wide range of sizes
  • Available with weld projections as well as solder seal


Side Braze Packages

Sidebraze packages are dual in-line packages with conventional through hole and J-bend lead configurations.

Chelsea Technology's Side Braze Packages offer:

  • Effective heat dissipation
  • Hermetical seal
  • Ease of PC board mounting
  • Ease of soldering and removal
  • Leads with .100 inch spacing

Side Braze Packages
 
 
 

Email Us: info@chelseatech.com
Chelsea Technology, Inc. 300 Willow Street, North Andover, MA 01845 USA
tel: 978 682-3000 fax: 978 682-2223
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