| Lids
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Ceramic Lids
Ceramic Lids are used primarily with Cerquad packages
that require a glass or B-staged epoxy coated seal.
These lids are used on various multilayer packages where
temperature constraints after die attach require a low
temperature lid seal.
Chelsea
Technology Lids feature:
- Available
in a wide variety of shapes, sizes and thickness
- Low
temperature epoxy or glass seal
- Solid
or window options
- Marking
permanency
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Combo Lids ™
Combo Lids ™ are a metal alloy combination lid / preform
assembly that offers a true hermetic seal for semiconductor
packages.
Chelsea
Technology Combo Lids ™ feature:
- Highest
quality Kovar or Alloy 42 plated to exceed Mil-G 45204
type III grade A
- Ideal
alignment of lid and preform
- Moisture
and corrosion resistance
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Epoxy Lids
Epoxy lids are available with partially cured B staged
polymers on the sealing surface to give a one step sealing
system.
Epoxy
lids offer:
- Excellent
adhesion: metal-glass-ceramics-plastics
- Low
temperature sealing and curing
- High
gel strength
- Excellent
chemical resistance
- Suited
for automated handling equipment
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TO Cans
TO Cans are available in a wide assortment of sizes
designed to work with the transistor outline headers.
Available with weld projections as well as solder seal.
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Step Lids
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Window Lids (Bulls-Eye Lids)
Bulls-eye lids are glass Kovar lids with a hermetic
glass to metal sealed window designed for E-PROM applications.
Bulls-eye
lids:
- Glass
enables quick erasure and reprogramming of the semiconductor
chip
- Glass
to metal seal is hermetic and passes leak test MIL
STD 883, Method 1014
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