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BeO Substrates
Beryllium Oxide (Beryllia) substrates have thermal conductivity
of 260 W/mk - that makes it the desirable material for high
power microelectronic applications.
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Die-Attach Pre-forms
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Dummy Components
Dummy Components are the exact mechanical equivalent of fully
functional, electronically active components, but they are
up to 80% cheaper. Dummy components look, handle and solder
exactly the same as active components and will save you money!
Chelsea
Technology dummy components are used for:
- Prototypes
and testing
- Machine
setup and evaluation
- Assembly
workflow evaluation
- Soldering
training, practice and certification
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Flat-Pack Carriers and Clips
Chelsea Technology offers over 100 standard flat-pack carriers
in addition to thousands of custom versions.
Chelsea
Technology carriers:
- Can
be molded from Electro-Static-Dissipative (EDS) materials
- Used
to fully automate handling, testing, and processing
- Notches
on the carrier body assure proper orientation
- Can
be molded of high temperature materials for applications
up to 200°C
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Heat Sinks
Chelsea Technology heat sinks provide maximum thermal performance
within industry standard microprocessor design parameters.
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Lead Frames
Chelsea Technology offers lead frames for Cerdip / Cerpak.
Contact us for available lead counts.
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Laser Scribed Packages |
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Burn-in/Test Sockets
Chelsea Technology burn-in/test sockets feature zero insertion
force with normally closed contacts
- Special
Clip design allows lid removal for easy contact replacement
if required
- Detents
allow for positive handle locations, horizontal closed position
or vertical open position
- Keyed
hole plug available for device orientation
- For
burn-in applications up to 150°C
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